Devcon Aluminum Filled Epoxy Putty

Product Description

Devcon Aluminum Putty F

Product features: Devcon Aluminum Putty Can be machined, drilled, or tapped using conventional metalworking tools Bonds to aluminium, concrete, and many other metals Fill voids or pores in castings.

Limitations: Devcon Aluminum Putty is Not recommended for long-term exposure to concentrated acids and organic solvents.

Typical Physical Properties: Technical data should be considered representative or typical only and should not be used for specification purposes Cured 7 days @ 75 Degrees Farenheight.

Color Aluminum

Mix Ratio by Volume - 4:1

Mix Ratio by Weight - 9:1

% Solids by Volume - 100

Pot Life  75degrees 60 min

Specific Volume 17.5 in.(3) /lb

Cured Shrinkage 0008 in./in

Specific Gravity 1.58 gm/cc

Temperature Resistance Wet: 120°F; Dry: 250 degrees

Coverage/lb - 70 sq.in./lb. 1/4"

Cured Hardness - 85 D

Dielectric Strength - 100 volts/mil

Dielectric Constant - 21.4

Adhesive Tensile Shear - 2,600 psi

Compressive Strength - 8,420 psi

Modulus Elasticity - 8.0 psi x 10(5) in

Flexural Strength - 6,760 psi

Coefficient Degrees Farenheight Thermal Expansion - 29 [(in.)/(in). x °F)] x 10(-6)

Thermal Conductivity 1.73 [(cal x cm)/(sec x cm(2) x °C)] x 10(-3)

Cure Time - 16 hrs

Recoat Time - 10-12 hrs

Mixed Viscosity - Putty

TESTS CONDUCTED :

Compressive Strength ASTM D 695

Cured Hardness Shore D ASTM D 2240

Dielectric Constant ASTM D 150

Modulus of Elasticity ASTM D 638

Cure Shrinkage ASTM D 2566

Adhesive Tensile Shear ASTM D 1002

Dielectric Strength, volts/mil ASTM D 149

Coef.of Thermal Expansion ASTM D 696

Flexural Strength ASTM D 790