Devcon Aluminum Putty F
Product features: Devcon Aluminum Putty Can be machined, drilled, or tapped using conventional metalworking tools Bonds to aluminium, concrete, and many other metals Fill voids or pores in castings.
Limitations: Devcon Aluminum Putty is Not recommended for long-term exposure to concentrated acids and organic solvents.
Typical Physical Properties: Technical data should be considered representative or typical only and should not be used for specification purposes Cured 7 days @ 75 Degrees Farenheight.
Color Aluminum
Mix Ratio by Volume - 4:1
Mix Ratio by Weight - 9:1
% Solids by Volume - 100
Pot Life 75degrees 60 min
Specific Volume 17.5 in.(3) /lb
Cured Shrinkage 0008 in./in
Specific Gravity 1.58 gm/cc
Temperature Resistance Wet: 120°F; Dry: 250 degrees
Coverage/lb - 70 sq.in./lb. 1/4"
Cured Hardness - 85 D
Dielectric Strength - 100 volts/mil
Dielectric Constant - 21.4
Adhesive Tensile Shear - 2,600 psi
Compressive Strength - 8,420 psi
Modulus Elasticity - 8.0 psi x 10(5) in
Flexural Strength - 6,760 psi
Coefficient Degrees Farenheight Thermal Expansion - 29 [(in.)/(in). x °F)] x 10(-6)
Thermal Conductivity 1.73 [(cal x cm)/(sec x cm(2) x °C)] x 10(-3)
Cure Time - 16 hrs
Recoat Time - 10-12 hrs
Mixed Viscosity - Putty
TESTS CONDUCTED :
Compressive Strength ASTM D 695
Cured Hardness Shore D ASTM D 2240
Dielectric Constant ASTM D 150
Modulus of Elasticity ASTM D 638
Cure Shrinkage ASTM D 2566
Adhesive Tensile Shear ASTM D 1002
Dielectric Strength, volts/mil ASTM D 149
Coef.of Thermal Expansion ASTM D 696
Flexural Strength ASTM D 790