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MOLYKOTE 340 SILICONE HEAT SINK COMPOUND
3500 INR/Piece
Product Details:
- Ash % < 1.0%
- Packaging Type Tube
- Color WHITE
- Type Grease
- Operating Temperature -40C to +200C
- Application Thermal interface and heat dissipation for electrical and electronic components
- Chemical Composition Silicone compound with thermally conductive fillers
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MOLYKOTE 340 SILICONE HEAT SINK COMPOUND Price And Quantity
- 3500 INR/Piece
- 12 Piece
MOLYKOTE 340 SILICONE HEAT SINK COMPOUND Product Specifications
- High (specific value not stated)
- Yes
- Silicone
- Used as heat transfer compound for heat sinks, transistors, diodes, rectifiers, power semiconductors, and electronic assembly
- < 0.5%
- Silicone Oil
- 142 gram Grams (g)
- 2.2 Gram per cubic centimeter(g/cm3)
- 100g, 142g
- Odorless
- Silicone compound with thermally conductive fillers
- -40C to +200C
- Thermal interface and heat dissipation for electrical and electronic components
- Grease
- WHITE
- < 1.0%
- Tube
- TUBE
MOLYKOTE 340 SILICONE HEAT SINK COMPOUND Trade Information
- Surat
- Cheque, Cash Advance (CA), Cash in Advance (CID)
- 1 Days
- If order is confirmed we will reimburse the sample cost
Product Description
MOLYKOTE 340 SILICONE HEAT SINK COMPOUND White, non-curing and non-flowing thermally conductive compound Non-flowing Moderate thermal conductivity No need for ovens or curing Heat flow away from circuitry components can increase reliability Composition Zinc oxide Polydimethylsiloxane Applications DOWSIL 340 Heat Sink Compound is suitable for thermal coupling of electrical devices and PCB assemblies to heat sinks. Dow thermally conductive compounds are grease like silicone materials, heavily filled with heat-conductive metal oxides. This combination promotes high thermal conductivity, low bleed and high-temperature stability. The compounds are designed to maintain a positive heat sink seal to improve heat transfer from the electrical device or PCB system assemblies to the heat sink or chassis, thereby increasing the overall efficiency of the device. or PCB system assemblies are continually designed to deliver higher performance. Especially in the area of consumer devices, there is also a continual trend towards smaller, more compact designs. In combination these factors typically mean that more heat is generated in the device. Thermal management of PCB system assemblies is a primary concern of design engineers. A cooler device allows for more efficient operation and better reliability over the life of the device. As such, thermally conductive compounds play an integral role here. Thermally conductive materials act as a thermal "bridge to remove heat from a heat source (device) to the ambient via a heat transfer media (i.e. heat sink). These materials have properties such as low thermal resistance, high thermal conductivity, and can achieve thin Bond Line Thicknesses (BLTs) which can help to improve the transfer of heat away from the device.Reliable Thermal Management for Electronics
MOLYKOTE 340 Silicone Heat Sink Compound excels in bridging the thermal interface between electronic components and heat sinks. Its formulation guarantees both superior heat transfer and electrical insulation, making it indispensable for maintaining operational stability in electronic assemblies.
Outstanding Stability and Safety
Engineered to be non-corrosive, non-flammable, and resistant to bleed or evaporation even after 24 hours at 200C, this compound ensures long-term reliability. Its shelf life extends up to 36 months if stored unopened, offering convenience for distributors and users alike.
FAQs of MOLYKOTE 340 SILICONE HEAT SINK COMPOUND:
Q: How should MOLYKOTE 340 Silicone Heat Sink Compound be applied to electronic components?
A: For optimal performance, apply a thin and even layer of MOLYKOTE 340 compound to the mating surfaces of the heat sink and the electronic component. Spreading should be done until the surface is just covered to avoid excessive use, which can hinder heat transfer.Q: What benefits does MOLYKOTE 340 offer compared to conventional thermal pastes?
A: MOLYKOTE 340 provides a higher thermal conductivity (0.57 W/mK typical), superior dielectric strength (>10 kV/mm), and excellent stability against bleed and evaporation. Its non-corrosive and non-flammable nature ensures enhanced safety and longevity for both users and components.Q: When is it appropriate to use MOLYKOTE 340 Silicone Heat Sink Compound?
A: This compound is best used during the assembly or maintenance of electronic devices where efficient heat dissipation is required. Typical applications include mounting transistors, diodes, rectifiers, and power semiconductors onto heat sinks.Q: Where can MOLYKOTE 340 be applied for maximum effectiveness?
A: It should be applied at the interface between any heat-generating electronic component (such as CPUs, power modules, or LEDs) and their respective heat sinks to maximize thermal transfer and protect against overheating.Q: What is the process for storing and handling MOLYKOTE 340 to ensure shelf life?
A: Store the tube unopened in a cool, dry place away from direct sunlight. Ensuring proper storage conditions maintains its shelf life of up to 36 months from the production date.Q: What types of environments or temperatures can MOLYKOTE 340 withstand during use?
A: This silicone compound is designed for continuous operation in environments ranging from -40C to +200C, making it suitable for demanding industrial and electronic applications.Tell us about your requirement
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