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MOLYKOTE 340 SILICONE HEAT SINK COMPOUND

MOLYKOTE 340 SILICONE HEAT SINK COMPOUND

3500 INR/Piece

Product Details:

  • Color WHITE
  • Type Grease
  • Weight 142 gram Grams (g)
  • Pack Type TUBE
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MOLYKOTE 340 SILICONE HEAT SINK COMPOUND Price And Quantity

  • 12 Piece
  • 3500 INR/Piece

MOLYKOTE 340 SILICONE HEAT SINK COMPOUND Product Specifications

  • Grease
  • WHITE
  • 142 gram Grams (g)
  • TUBE

MOLYKOTE 340 SILICONE HEAT SINK COMPOUND Trade Information

  • Surat
  • Cheque Cash Advance (CA) Cash in Advance (CID)
  • 1 Days
  • If order is confirmed we will reimburse the sample cost

Product Description

MOLYKOTE 340 SILICONE HEAT SINK COMPOUND White, non-curing and non-flowing thermally conductive compound Non-flowing Moderate thermal conductivity No need for ovens or curing Heat flow away from circuitry components can increase reliability Composition  Zinc oxide Polydimethylsiloxane Applications  DOWSIL 340 Heat Sink Compound is suitable for thermal coupling of electrical devices and PCB assemblies to heat sinks. Dow thermally conductive compounds are grease like silicone materials, heavily filled with heat-conductive metal oxides. This combination promotes high thermal conductivity, low bleed and high-temperature stability. The compounds are designed to maintain a positive heat sink seal to improve heat transfer from the electrical device or PCB system assemblies to the heat sink or chassis, thereby increasing the overall efficiency of the device. or PCB system assemblies are continually designed to deliver higher performance. Especially in the area of consumer devices, there is also a continual trend towards smaller, more compact designs. In combination these factors typically mean that more heat is generated in the device. Thermal management of PCB system assemblies is a primary concern of design engineers. A cooler device allows for more efficient operation and better reliability over the life of the device. As such, thermally conductive compounds play an integral role here. Thermally conductive materials act as a thermal "bridgeï to remove heat from a heat source (device) to the ambient via a heat transfer media (i.e. heat sink). These materials have properties such as low thermal resistance, high thermal conductivity, and can achieve thin Bond Line Thicknesses (BLTs) which can help to improve the transfer of heat away from the device.
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